100% material declaration data sheet TQG144 pk126 (v1.2.1) october 19, 2006 material declaration data sheet average weight: 1.4 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.0147 1.05% silicon 7440-21-3 100.00 0.0147 die attach material 0.00224 0.16% silver 7440-22-4 78.00 0.0017472 epoxy (ep) trade secret 22.00 0.0004928 mold compound 1.10208 78.72% epoxy resin (ep) trade secret 9.00 0.0991872 phenolic resin trade secret 7.00 0.0771456 carbon black 1333-86-4 0.50 0.0055104 silica 60676-86-0 82.50 0.909216 bismuth 7440-69-9 max 1.00 0.0110208 leadframe 0.26124 18.66% copper 7440-50-8 98.85 0.25823574 chromium 7440-47-3 0.30 0.00078372 tin 7440-31-5 0.25 0.0006531 zinc 7440-66-6 0.60 0.00156744 leadframe plating 0.00112 0.08% silver 7440-22-4 100.00 0.00112 bond wire 0.00616 0.44% gold 7440-57-5 100.00 0.00616 ext. plating 0.01246 0.89% tin 7440-31-5 100.00 0.01246 pk126 (v1.2.1) october 19, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? TQG144 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 2/09/06 1.0 initial release. 7/10/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. 10/19/06 1.2.1 editorial c hange; corrected typo in substance description. pk126 (v1.2.1) october 19, 2006
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